焦磷酸铜 (CAS No.10102-90-6)
- 物化性质
- 淡绿色粉末，不溶于水，溶于酸和氨水。具有特有的晶体结构，超低的铁、铅、砷含量，易被焦磷酸钾络合，使镀液具备优异的极化能力和电流分散能力。
- 技术参数
- 纯度符合电镀级标准，杂质含量低。 Fe、Pb、As含量超低，保证镀液稳定性。 配制的镀液无需电解处理即可直接使用。 镀层晶体结构规则、精细、致密无孔隙。 镀液抗干扰能力强，适用于连续电镀生产。
English description（英文原文，共 1212 字符）
Product Name:Cupric Pyrophosphate
English Name:Cupric Pyrophosphate
CAS No.:10102-90-6
Aliases:Copper(II) pyrophosphate, Cupric pyrophosphate salt
Molecular Formula:Cu2P2O7
Physical Properties:Light green powder, insoluble in water, soluble in acids and ammonia. Possesses a unique crystal structure with extremely low iron, lead, and arsenic content. It is readily complexed by potassium pyrophosphate, giving the plating bath excellent polarization ability and current distribution capability.
Uses:Mainly used for preparing pyrophosphate copper plating baths. It can be used directly for electroplating without electrolytic pretreatment, offering high plating speed and producing uniform, dense, pore-free deposits. Suitable for copper electroplating in electronics and hardware industries.
Technical Specifications:
Purity meets electroplating grade standards with low impurity content.
Ultra-low Fe, Pb, and As content ensures bath stability.
Prepared plating solution can be used directly without electrolysis treatment.
Deposits have regular, fine, dense, and pore-free crystal structure.
Plating bath has strong anti-interference capability, suitable for continuous electroplating production.
English Name:Cupric Pyrophosphate
CAS No.:10102-90-6
Aliases:Copper(II) pyrophosphate, Cupric pyrophosphate salt
Molecular Formula:Cu2P2O7
Physical Properties:Light green powder, insoluble in water, soluble in acids and ammonia. Possesses a unique crystal structure with extremely low iron, lead, and arsenic content. It is readily complexed by potassium pyrophosphate, giving the plating bath excellent polarization ability and current distribution capability.
Uses:Mainly used for preparing pyrophosphate copper plating baths. It can be used directly for electroplating without electrolytic pretreatment, offering high plating speed and producing uniform, dense, pore-free deposits. Suitable for copper electroplating in electronics and hardware industries.
Technical Specifications:
Purity meets electroplating grade standards with low impurity content.
Ultra-low Fe, Pb, and As content ensures bath stability.
Prepared plating solution can be used directly without electrolysis treatment.
Deposits have regular, fine, dense, and pore-free crystal structure.
Plating bath has strong anti-interference capability, suitable for continuous electroplating production.
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常见问题
- 焦磷酸铜的 CAS 号是多少？
- 焦磷酸铜的 CAS 号是 10102-90-6。
- 焦磷酸铜的分子式和分子量是什么？
- 焦磷酸铜的分子式为 Cu2P2O7。
- 焦磷酸铜的英文名称是什么？
- 焦磷酸铜的英文名称为 Cupric Pyrophosphate。
- 焦磷酸铜还有哪些别名？
- 焦磷酸铜又称 焦磷酸铜(II)、焦磷酸铜盐。
- 焦磷酸铜有哪些供应商和生产厂家？
- 掌上化工当前收录 1 条焦磷酸铜供应报价，来自 1 家供应商，可按地区、纯度、级别筛选对比。
- 焦磷酸铜的供应商主要分布在哪些地区？
- 焦磷酸铜的供应商主要分布在 上海市（1 条） 等地。
- 焦磷酸铜有哪些级别可选？
- 平台上焦磷酸铜的供应级别包括 工业级。
- 焦磷酸铜的报价单位是什么？
- 焦磷酸铜的报价单位主要有 千克。
- 哪里可以查到焦磷酸铜的价格？
- 掌上化工焦磷酸铜产品页汇总了各供应商的最新报价与规格，地址：/chemicals/10102-90-6/。部分供应商价格为电议，可通过页面上的询价功能直接获取。
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