3,3'5,5'-四甲基联苯双酚二缩水甘油醚 (CAS No.85954-11-6)
- 物化性质
- 白色至淡黄色结晶固体,溶于丙酮、甲苯、二甲苯等有机溶剂,不溶于水。熔点约100~110℃,密度约1.15~1.20 g/cm³(25℃),理论环氧当量约177 g/eq。具有低离子杂质、良好的耐热性和耐化学介质性。
- 外观
- 白色至淡黄色结晶固体。
- 熔点
- 100~110℃。
- 密度
- 1.15~1.20 g/cm³(25℃)。
- 溶解性
- 易溶于丙酮、甲苯等有机溶剂,不溶于水。
English description(英文原文,共 1418 字符)
Product Name:3,3',5,5'-Tetramethylbiphenyl-4,4'-diol diglycidyl ether
English Name:3,3',5,5'-Tetramethylbiphenyl-4,4'-diol diglycidyl ether
CAS No.:85954-11-6
Aliases:3,3',5,5'-Tetramethylbiphenyl-4,4'-diol diglycidyl ether, Tetramethylbiphenyl-4,4'-diol diglycidyl ether
Molecular Formula:C22H26O4
Physical Properties:White to light yellow crystalline solid, soluble in organic solvents such as acetone, toluene and xylene, insoluble in water. Melting point approximately 100–110°C, density approximately 1.15–1.20 g/cm³ (25°C), theoretical epoxy equivalent weight approximately 177 g/eq. Features low ionic impurities, good heat resistance and chemical resistance.
Uses:Used for preparing high-performance epoxy resin systems, particularly suitable for electronic encapsulation materials, semiconductor molding compounds, electrical insulating materials and high-temperature resistant composite materials. It can significantly improve the heat resistance, low moisture absorption and mechanical strength of cured products, and is also used in high-performance coatings and structural adhesives.
Technical Specifications:
Appearance: white to light yellow crystalline solid.
Epoxy equivalent weight: 170–190 g/eq (theoretical value approx. 177 g/eq).
Melting point: 100–110°C.
Density: 1.15–1.20 g/cm³ (25°C).
Solubility: readily soluble in acetone, toluene and other organic solvents, insoluble in water.
English Name:3,3',5,5'-Tetramethylbiphenyl-4,4'-diol diglycidyl ether
CAS No.:85954-11-6
Aliases:3,3',5,5'-Tetramethylbiphenyl-4,4'-diol diglycidyl ether, Tetramethylbiphenyl-4,4'-diol diglycidyl ether
Molecular Formula:C22H26O4
Physical Properties:White to light yellow crystalline solid, soluble in organic solvents such as acetone, toluene and xylene, insoluble in water. Melting point approximately 100–110°C, density approximately 1.15–1.20 g/cm³ (25°C), theoretical epoxy equivalent weight approximately 177 g/eq. Features low ionic impurities, good heat resistance and chemical resistance.
Uses:Used for preparing high-performance epoxy resin systems, particularly suitable for electronic encapsulation materials, semiconductor molding compounds, electrical insulating materials and high-temperature resistant composite materials. It can significantly improve the heat resistance, low moisture absorption and mechanical strength of cured products, and is also used in high-performance coatings and structural adhesives.
Technical Specifications:
Appearance: white to light yellow crystalline solid.
Epoxy equivalent weight: 170–190 g/eq (theoretical value approx. 177 g/eq).
Melting point: 100–110°C.
Density: 1.15–1.20 g/cm³ (25°C).
Solubility: readily soluble in acetone, toluene and other organic solvents, insoluble in water.
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常见问题
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚的 CAS 号是多少?
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚的 CAS 号是 85954-11-6。
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚的分子式和分子量是什么?
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚的分子式为 C22H26O4。
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚的英文名称是什么?
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚的英文名称为 3,3',5,5'-Tetramethylbiphenyl-4,4'-diol diglycidyl ether。
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚还有哪些别名?
- 3,3'5,5'-四甲基联苯双酚二缩水甘油醚又称 3,3',5,5'-四甲基联苯二酚二缩水甘油醚、四甲基联苯二酚二缩水甘油醚。
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