实验室小型真空等离子清洗机 (CAS No.None)
- 物化性质
- 该设备利用真空条件下射频放电激发工艺气体(如氧气、氩气、氮气)产生低温等离子体,通过高能活性粒子对材料表面进行物理轰击与化学刻蚀,属于常温干式处理工艺。可有效去除表面有机污染物、氧化层及微尘,同时增加表面粗糙度和亲水性。
- 技术参数
- 腔体尺寸约215mm×280mm,适合小批量样品处理。 射频电源频率13.56MHz,功率0-300W连续可调。 极限真空度低于10Pa,工作真空度10-100Pa。 标配两路工艺气体接口,配备质量流量计精确控制气体流量。 PLC触摸屏控制,支持多段工艺程序自动运行。
English description(英文原文,共 1466 字符)
Product Name:Laboratory Compact Vacuum Plasma Cleaner
English Name:Laboratory Compact Vacuum Plasma Cleaner
Aliases:Vacuum plasma cleaning system, Plasma surface treatment system, Benchtop plasma cleaner
Physical Properties:This equipment generates low-temperature plasma within a vacuum chamber by radio-frequency discharge of process gases such as oxygen, argon or nitrogen. The highly reactive active species physically bombard and chemically etch the substrate surface, providing a room-temperature dry process. It effectively removes organic contaminants, oxide layers and microscopic dust while increasing surface roughness and hydrophilicity.
Uses:It is widely used in semiconductor, photovoltaic, LED, medical device and scientific research fields to remove organic residues and oxide layers from material surfaces and to activate polymer surfaces for improved bonding, printing or coating performance. The compact benchtop design is well suited for small-batch processing and process development in the laboratory.
Technical Specifications:
Chamber size: approximately 215 mm × 280 mm, suitable for small-batch sample processing.
RF power supply: 13.56 MHz, continuously adjustable output from 0 to 300 W.
Ultimate vacuum below 10 Pa; working vacuum range 10-100 Pa.
Equipped with two process gas inlets, each controlled by a mass flow controller for precise gas flow regulation.
PLC touch-screen control with multi-step automatic process recipes.
English Name:Laboratory Compact Vacuum Plasma Cleaner
Aliases:Vacuum plasma cleaning system, Plasma surface treatment system, Benchtop plasma cleaner
Physical Properties:This equipment generates low-temperature plasma within a vacuum chamber by radio-frequency discharge of process gases such as oxygen, argon or nitrogen. The highly reactive active species physically bombard and chemically etch the substrate surface, providing a room-temperature dry process. It effectively removes organic contaminants, oxide layers and microscopic dust while increasing surface roughness and hydrophilicity.
Uses:It is widely used in semiconductor, photovoltaic, LED, medical device and scientific research fields to remove organic residues and oxide layers from material surfaces and to activate polymer surfaces for improved bonding, printing or coating performance. The compact benchtop design is well suited for small-batch processing and process development in the laboratory.
Technical Specifications:
Chamber size: approximately 215 mm × 280 mm, suitable for small-batch sample processing.
RF power supply: 13.56 MHz, continuously adjustable output from 0 to 300 W.
Ultimate vacuum below 10 Pa; working vacuum range 10-100 Pa.
Equipped with two process gas inlets, each controlled by a mass flow controller for precise gas flow regulation.
PLC touch-screen control with multi-step automatic process recipes.
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常见问题
- 实验室小型真空等离子清洗机的 CAS 号是多少?
- 实验室小型真空等离子清洗机的 CAS 号是 None。
- 实验室小型真空等离子清洗机的英文名称是什么?
- 实验室小型真空等离子清洗机的英文名称为 Laboratory Compact Vacuum Plasma Cleaner。
- 实验室小型真空等离子清洗机还有哪些别名?
- 实验室小型真空等离子清洗机又称 真空等离子清洗机、等离子表面处理器、实验室用等离子清洗设备。
- 实验室小型真空等离子清洗机有哪些供应商和生产厂家?
- 掌上化工当前收录 1 条实验室小型真空等离子清洗机供应报价,来自 1 家供应商,可按地区、纯度、级别筛选对比。
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- 平台上实验室小型真空等离子清洗机的供应级别包括 工业级。
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