智能等离子清洗刻蚀机 (CAS No.None)
- 中文别名
- 等离子清洗机；等离子刻蚀机；真空等离子处理设备
- 英文名称
- Intelligent Plasma Cleaner & Etcher
- 所属类别
- 试剂实验设备
- 物化性质
- 等离子体是物质的第四种状态，由高速运动的电子、激活态中性原子/分子/自由基、离子化粒子及未反应分子组成，整体保持电中性。设备采用数控技术，自动化程度高，支持自动/手动双模式，自动模式可设定2次清洗和2次进气，清洗时间及进气稳定时间独立可调；手动模式具备定时停机功能。可选配输出比例阀控制气体流速以均衡腔体压力，可选配质量流量计实现分段气体流速控制。等离子体清洗不产生表面损伤层，且真空环境下处理可避免二次污染。真空腔体可选不锈钢或石英材质，容积有2L、5L、10L、20L、30L等规格。
- 技术参数
- 真空腔体容积可选2L、5L、10L、20L、30L，材质为不锈钢或石英 电源频率可选40KHz、13.56MHz、2.45GHz，其中13.56MHz需配备阻抗匹配器 控制方式支持半自动、全自动、PC电脑控制及液晶触摸屏(PLC)控制 自动模式下可实现2次清洗和2次进气，清洗时间与进气稳定时间均可独立设定 可选配输出比例阀或质量流量计，实现气体流速精确控制与腔体压力均衡
English description（英文原文，共 2103 字符）
Product Name:Intelligent Plasma Cleaner & Etcher
English Name:Intelligent Plasma Cleaner & Etcher
Aliases:Plasma Cleaning Machine, Plasma Etching System, Vacuum Plasma Treatment Equipment
Physical Properties:Plasma is considered the fourth state of matter, consisting of high-speed electrons, activated neutral atoms/molecules/free radicals, ionized particles, and unreacted molecules while maintaining overall electrical neutrality. The equipment features CNC technology with high automation and a clear interface. It supports both automatic and manual modes; the automatic mode allows two cleaning cycles and two gas inlet steps, with adjustable cleaning duration and gas stabilization time, while the manual mode provides a timed shutdown function. An optional proportional valve controls gas flow rate to balance chamber pressure, and an optional mass flow controller enables segmented gas flow control. Plasma cleaning does not create a damage layer on the surface, and the vacuum environment prevents secondary contamination. The vacuum chamber is available in stainless steel or quartz, with volumes of 2L, 5L, 10L, 20L, and 30L.
Uses:Widely used in semiconductor, microelectronics, PCB, LED, and photovoltaic industries to remove organic contaminants and oxide layers from substrate surfaces, as well as for surface activation and hydrophilicity improvement. It is also suitable for plasma cleaning and etching of precision components, enhancing the quality of subsequent coating, bonding, and lamination processes.
Technical Specifications:
Vacuum chamber available in 2L, 5L, 10L, 20L, and 30L volumes, made of stainless steel or quartz
Power frequency options: 40KHz, 13.56MHz, and 2.45GHz; 13.56MHz requires an impedance matching unit
Control modes include semi-automatic, fully automatic, PC-based, and LCD touch screen (PLC) control
Automatic mode supports two cleaning cycles and two gas inlet steps with independently adjustable cleaning and gas stabilization times
Optional proportional valve or mass flow controller for precise gas flow control and chamber pressure balancing
English Name:Intelligent Plasma Cleaner & Etcher
Aliases:Plasma Cleaning Machine, Plasma Etching System, Vacuum Plasma Treatment Equipment
Physical Properties:Plasma is considered the fourth state of matter, consisting of high-speed electrons, activated neutral atoms/molecules/free radicals, ionized particles, and unreacted molecules while maintaining overall electrical neutrality. The equipment features CNC technology with high automation and a clear interface. It supports both automatic and manual modes; the automatic mode allows two cleaning cycles and two gas inlet steps, with adjustable cleaning duration and gas stabilization time, while the manual mode provides a timed shutdown function. An optional proportional valve controls gas flow rate to balance chamber pressure, and an optional mass flow controller enables segmented gas flow control. Plasma cleaning does not create a damage layer on the surface, and the vacuum environment prevents secondary contamination. The vacuum chamber is available in stainless steel or quartz, with volumes of 2L, 5L, 10L, 20L, and 30L.
Uses:Widely used in semiconductor, microelectronics, PCB, LED, and photovoltaic industries to remove organic contaminants and oxide layers from substrate surfaces, as well as for surface activation and hydrophilicity improvement. It is also suitable for plasma cleaning and etching of precision components, enhancing the quality of subsequent coating, bonding, and lamination processes.
Technical Specifications:
Vacuum chamber available in 2L, 5L, 10L, 20L, and 30L volumes, made of stainless steel or quartz
Power frequency options: 40KHz, 13.56MHz, and 2.45GHz; 13.56MHz requires an impedance matching unit
Control modes include semi-automatic, fully automatic, PC-based, and LCD touch screen (PLC) control
Automatic mode supports two cleaning cycles and two gas inlet steps with independently adjustable cleaning and gas stabilization times
Optional proportional valve or mass flow controller for precise gas flow control and chamber pressure balancing
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常见问题
- 智能等离子清洗刻蚀机的 CAS 号是多少？
- 智能等离子清洗刻蚀机的 CAS 号是 None。
- 智能等离子清洗刻蚀机的英文名称是什么？
- 智能等离子清洗刻蚀机的英文名称为 Intelligent Plasma Cleaner & Etcher。
- 智能等离子清洗刻蚀机还有哪些别名？
- 智能等离子清洗刻蚀机又称 等离子清洗机、等离子刻蚀机、真空等离子处理设备。
- 智能等离子清洗刻蚀机有哪些供应商和生产厂家？
- 掌上化工当前收录 1 条智能等离子清洗刻蚀机供应报价，来自 1 家供应商，可按地区、纯度、级别筛选对比。
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- 智能等离子清洗刻蚀机的供应商主要分布在 上海市（1 条） 等地。
- 智能等离子清洗刻蚀机有哪些级别可选？
- 平台上智能等离子清洗刻蚀机的供应级别包括 工业级。
- 智能等离子清洗刻蚀机的报价单位是什么？
- 智能等离子清洗刻蚀机的报价单位主要有 千克。
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- 掌上化工智能等离子清洗刻蚀机产品页汇总了各供应商的最新报价与规格，地址：/chemicals/zhi-neng-deng-li-zi-qing-xi-ke-shi-ji/。部分供应商价格为电议，可通过页面上的询价功能直接获取。
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