Zytel HTNFG52G35HSLBK011 PPA (CAS No.None)
- 物化性质
- 半结晶性高温聚酰胺树脂，具有高热变形温度、优异的耐化学腐蚀性和低吸湿性，典型密度约1.35 g/cm³，玻璃化转变温度高，长期耐热老化性能良好。
- 技术参数
- 35%玻璃纤维增强 热稳定级（HSL），黑色（BK011） 熔点约310°C 密度约1.35 g/cm³ 热变形温度>280°C（0.45 MPa）
English description（英文原文，共 887 字符）
Product Name:Zytel HTNFG52G35HSLBK011 PPA
English Name:Zytel HTNFG52G35HSLBK011 PPA
Aliases:Polyphthalamide, PPA
Physical Properties:Semi-crystalline high-temperature polyamide resin with high heat deflection temperature, excellent chemical resistance, and low moisture absorption. Typical density is about 1.35 g/cm³, high glass transition temperature, and good long-term thermal aging resistance.
Uses:Primarily used for electronic plastic parts and automotive components, such as high-temperature connectors, sensor housings, and under-hood structural parts. Suitable for applications requiring high heat resistance, chemical resistance, and dimensional stability.
Technical Specifications:
35% glass fiber reinforced
Heat-stabilized grade (HSL), black (BK011)
Melting point approximately 310°C
Density approximately 1.35 g/cm³
Heat deflection temperature >280°C at 0.45 MPa
English Name:Zytel HTNFG52G35HSLBK011 PPA
Aliases:Polyphthalamide, PPA
Physical Properties:Semi-crystalline high-temperature polyamide resin with high heat deflection temperature, excellent chemical resistance, and low moisture absorption. Typical density is about 1.35 g/cm³, high glass transition temperature, and good long-term thermal aging resistance.
Uses:Primarily used for electronic plastic parts and automotive components, such as high-temperature connectors, sensor housings, and under-hood structural parts. Suitable for applications requiring high heat resistance, chemical resistance, and dimensional stability.
Technical Specifications:
35% glass fiber reinforced
Heat-stabilized grade (HSL), black (BK011)
Melting point approximately 310°C
Density approximately 1.35 g/cm³
Heat deflection temperature >280°C at 0.45 MPa
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- Zytel HTNFG52G35HSLBK011 PPA又称 聚邻苯二甲酰胺、PPA。
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