HMDS真空烘箱 (CAS No.None)
- 物化性质
- 设备集真空、烘烤、充氮、洁净、HMDS加液多功能于一体，可在常压至极限真空度<10Pa范围内工作；温度控制范围为RT+25~200℃，温度分辨率±0.1℃；工作腔内氧含量可控制在10ppm以下，洁净度达Class 10级，适用于半导体晶圆片涂胶前的表面预处理。
English description（英文原文，共 1665 字符）
Product Name:HMDS Vacuum Oven
English Name:HMDS Vacuum Oven
Aliases:HMDS Pre-treatment Oven, HMDS Coating Oven
Physical Properties:The equipment integrates vacuum, heating, nitrogen purging, cleaning and HMDS liquid delivery functions, operating from atmospheric pressure down to an ultimate vacuum below 10 Pa. The temperature control range is RT+25~200°C with a resolution of ±0.1°C. The oxygen content in the working chamber can be controlled below 10 ppm with cleanliness up to Class 10, making it suitable for surface pretreatment of semiconductor wafers before photoresist coating.
Uses:Used for pre-treatment of semiconductor wafers before photolithography coating and HMDS adhesion promoter application. Through repeated pre-evacuation, nitrogen purging and heating cycles, the wafer surface is dried and cleaned, preventing oxidation and impurity diffusion; an HMDS protective film is formed on the wafer surface via the liquid delivery system to improve photoresist coating performance. Compared with manual HMDS application, it offers better repeatability, chemical savings, environmental friendliness and safety, and can also be used for cleaning in other wafer processes.
Technical Specifications:
Temperature range: RT+25~200°C, temperature resolution: ±0.1°C
Ultimate vacuum: <10 Pa, pumping speed: 4 L/s, time from atmospheric pressure to 100 Pa: <5 min
Oxygen content: <10 ppm, cleanliness: Class 10
Control mode: PLC + touch screen (HMI), chamber dimensions: W450×D450×H450 mm, nitrogen flow rate: 0-100 L/min
Power consumption: AC220V 50Hz 4.5kW; safety protection: grounding protection, overload protection, over-temperature protection
English Name:HMDS Vacuum Oven
Aliases:HMDS Pre-treatment Oven, HMDS Coating Oven
Physical Properties:The equipment integrates vacuum, heating, nitrogen purging, cleaning and HMDS liquid delivery functions, operating from atmospheric pressure down to an ultimate vacuum below 10 Pa. The temperature control range is RT+25~200°C with a resolution of ±0.1°C. The oxygen content in the working chamber can be controlled below 10 ppm with cleanliness up to Class 10, making it suitable for surface pretreatment of semiconductor wafers before photoresist coating.
Uses:Used for pre-treatment of semiconductor wafers before photolithography coating and HMDS adhesion promoter application. Through repeated pre-evacuation, nitrogen purging and heating cycles, the wafer surface is dried and cleaned, preventing oxidation and impurity diffusion; an HMDS protective film is formed on the wafer surface via the liquid delivery system to improve photoresist coating performance. Compared with manual HMDS application, it offers better repeatability, chemical savings, environmental friendliness and safety, and can also be used for cleaning in other wafer processes.
Technical Specifications:
Temperature range: RT+25~200°C, temperature resolution: ±0.1°C
Ultimate vacuum: <10 Pa, pumping speed: 4 L/s, time from atmospheric pressure to 100 Pa: <5 min
Oxygen content: <10 ppm, cleanliness: Class 10
Control mode: PLC + touch screen (HMI), chamber dimensions: W450×D450×H450 mm, nitrogen flow rate: 0-100 L/min
Power consumption: AC220V 50Hz 4.5kW; safety protection: grounding protection, overload protection, over-temperature protection
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常见问题
- HMDS真空烘箱的 CAS 号是多少？
- HMDS真空烘箱的 CAS 号是 None。
- HMDS真空烘箱的英文名称是什么？
- HMDS真空烘箱的英文名称为 HMDS Vacuum Oven。
- HMDS真空烘箱还有哪些别名？
- HMDS真空烘箱又称 HMDS预处理烘箱、HMDS涂覆烘箱。
- HMDS真空烘箱有哪些供应商和生产厂家？
- 掌上化工当前收录 1 条HMDS真空烘箱供应报价，来自 1 家供应商，可按地区、纯度、级别筛选对比。
- HMDS真空烘箱的供应商主要分布在哪些地区？
- HMDS真空烘箱的供应商主要分布在 上海市（1 条） 等地。
- HMDS真空烘箱有哪些级别可选？
- 平台上HMDS真空烘箱的供应级别包括 工业级。
- HMDS真空烘箱的报价单位是什么？
- HMDS真空烘箱的报价单位主要有 千克。
- 哪里可以查到HMDS真空烘箱的价格？
- 掌上化工HMDS真空烘箱产品页汇总了各供应商的最新报价与规格，地址：/chemicals/hmds-zhen-kong-hong-xiang/。部分供应商价格为电议，可通过页面上的询价功能直接获取。
以上信息由平台根据收录的产品数据自动生成，数据更新时间 。 价格与库存由供应商自行发布，实际交易请以询价结果为准。
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