LCP 6040GM 注塑级 (CAS No.None)

Product Name:LCP 6040GM Injection Molding Grade

English Name:LCP 6040GM Injection Molding Grade

Aliases:Liquid Crystal Polymer, LCP Resin

Molecular Formula:(C7H4O2·C11H6O2)n

Physical Properties:Beige opaque solid powder with a density of 1.35-1.45 g/cm³, melting point of approx. 280°C, and heat deflection temperature ≥240°C (1.82 MPa). It exhibits excellent high- and low-temperature resistance, chemical corrosion resistance, radiation resistance, and flame retardancy (UL 94 V-0), along with low water absorption, good dimensional stability, and outstanding electrical insulation and dielectric strength.

Uses:Mainly used in electronic and electrical fields, such as printed circuit boards, integrated circuit encapsulation materials, coil bobbin encapsulation, and optical fiber cable connector sheaths. It is also applied in aerospace exterior panels, automotive mechanical parts and braking systems, jet engine components, and medical devices. It can replace ceramics as packing materials in chemical separation towers and is suitable for microwave oven containers requiring high- and low-temperature resistance. Blended with polysulfone, PBT, or polyamide to form alloys, it significantly enhances mechanical strength, service strength, and chemical stability.

Technical Specifications:

Density: 1.35-1.45 g/cm³

Melting point: approx. 280°C

Heat deflection temperature (1.82 MPa): ≥240°C

Tensile strength (23°C): ≥150 MPa

Flammability rating: UL 94 V-0