聚酰亚胺树脂 (CAS No.62929-02-6)
- 物化性质
- 本品为琥珀色至深棕色固体颗粒或粉末，密度约1.3-1.4 g/cm³。易溶于二甲基甲酰胺(DMF)、二甲基乙酰胺(DMAC)、甲乙酮、四氢呋喃、二氧六环及混合溶剂，可配制成溶剂型液态胶粘剂。几乎不受强酸、强碱影响，具有良好的耐水性、耐有机溶剂性和耐油性。长期使用温度300℃，瞬间使用温度可达380℃，最低使用温度-160℃，属于耐高低温高性能树脂。
English description（英文原文，共 1972 字符）
Product Name:Polyimide Resin
English Name:Polyimide Resin
CAS No.:62929-02-6
Aliases:PI resin, Polyimide, High-temperature polyimide resin
Molecular Formula:(C22H10N2O5)n
Physical Properties:This product is an amber to dark brown solid resin in the form of granules or powder, with a density of approximately 1.3-1.4 g/cm³. It is readily soluble in dimethylformamide (DMF), dimethylacetamide (DMAC), methyl ethyl ketone, tetrahydrofuran, 1,4-dioxane and mixed solvents, and can be formulated into solvent-based liquid adhesives. It is almost unaffected by strong acids and alkalis, and exhibits excellent water resistance, organic solvent resistance and oil resistance. It has a long-term service temperature of 300°C, an instantaneous service temperature of up to 380°C, and a minimum service temperature of -160°C, making it a high-performance resin resistant to both high and low temperatures.
Uses:It is used in aviation, aerospace and high-grade insulation fields, and is suitable for manufacturing self-lubricating mechanical parts resistant to high and low temperatures. It can be used as a binder for diamond/CBN (cubic boron nitride) resin-bonded grinding wheels and high-grade abrasive tools, offering excellent heat resistance and wear resistance, moderate melt flow, convenient molding, no low-molecular-weight volatiles generated during curing, good compatibility with various fillers, and high bonding strength. It is also used as a matrix resin for high-performance resin-based composites, and for manufacturing high-performance electrical insulators and self-lubricating mechanical parts.
Technical Specifications:
Hot-press molding temperature: 220-230°C.
Hot-press pressure: 15-25 MPa.
Long-term service temperature: -160 to 300°C; instantaneous service temperature up to 380°C.
Readily soluble in DMF, DMAC, methyl ethyl ketone, tetrahydrofuran, 1,4-dioxane and other organic solvents.
Shelf life: one year when stored sealed in a dry place.
English Name:Polyimide Resin
CAS No.:62929-02-6
Aliases:PI resin, Polyimide, High-temperature polyimide resin
Molecular Formula:(C22H10N2O5)n
Physical Properties:This product is an amber to dark brown solid resin in the form of granules or powder, with a density of approximately 1.3-1.4 g/cm³. It is readily soluble in dimethylformamide (DMF), dimethylacetamide (DMAC), methyl ethyl ketone, tetrahydrofuran, 1,4-dioxane and mixed solvents, and can be formulated into solvent-based liquid adhesives. It is almost unaffected by strong acids and alkalis, and exhibits excellent water resistance, organic solvent resistance and oil resistance. It has a long-term service temperature of 300°C, an instantaneous service temperature of up to 380°C, and a minimum service temperature of -160°C, making it a high-performance resin resistant to both high and low temperatures.
Uses:It is used in aviation, aerospace and high-grade insulation fields, and is suitable for manufacturing self-lubricating mechanical parts resistant to high and low temperatures. It can be used as a binder for diamond/CBN (cubic boron nitride) resin-bonded grinding wheels and high-grade abrasive tools, offering excellent heat resistance and wear resistance, moderate melt flow, convenient molding, no low-molecular-weight volatiles generated during curing, good compatibility with various fillers, and high bonding strength. It is also used as a matrix resin for high-performance resin-based composites, and for manufacturing high-performance electrical insulators and self-lubricating mechanical parts.
Technical Specifications:
Hot-press molding temperature: 220-230°C.
Hot-press pressure: 15-25 MPa.
Long-term service temperature: -160 to 300°C; instantaneous service temperature up to 380°C.
Readily soluble in DMF, DMAC, methyl ethyl ketone, tetrahydrofuran, 1,4-dioxane and other organic solvents.
Shelf life: one year when stored sealed in a dry place.
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常见问题
- 聚酰亚胺树脂的 CAS 号是多少？
- 聚酰亚胺树脂的 CAS 号是 62929-02-6。
- 聚酰亚胺树脂的分子式和分子量是什么？
- 聚酰亚胺树脂的分子式为 (C22H10N2O5)n。
- 聚酰亚胺树脂的英文名称是什么？
- 聚酰亚胺树脂的英文名称为 Polyimide Resin。
- 聚酰亚胺树脂还有哪些别名？
- 聚酰亚胺树脂又称 聚酰亚胺、PI树脂、耐高温聚酰亚胺树脂。
- 聚酰亚胺树脂有哪些供应商和生产厂家？
- 掌上化工当前收录 1 条聚酰亚胺树脂供应报价，来自 1 家供应商，可按地区、纯度、级别筛选对比。
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- 平台上聚酰亚胺树脂的供应级别包括 工业级。
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- 聚酰亚胺树脂的报价单位主要有 千克。
- 哪里可以查到聚酰亚胺树脂的价格？
- 掌上化工聚酰亚胺树脂产品页汇总了各供应商的最新报价与规格，地址：/chemicals/62929-02-6/。部分供应商价格为电议，可通过页面上的询价功能直接获取。
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