高介电常数PC树脂 (CAS No.None)
- 物化性质
- 聚碳酸酯树脂，通常为透明或微黄色颗粒；密度约1.20 g/cm³，折射率约1.585；不溶于水，溶于二氯甲烷、氯仿等卤代烃；玻璃化转变温度约145～150℃，热变形温度约125～130℃，热分解温度高于300℃；具有高介电常数、低介电损耗、优异的尺寸稳定性和注塑成型性能。
- 密度
- 约1.20 g/cm³
English description（英文原文，共 1382 字符）
Product Name:High Dielectric Constant PC Resin
English Name:High Dielectric Constant PC Resin
CAS No.:25037-45-0
Aliases:High-k Polycarbonate Resin, High-k PC Resin
Molecular Formula:(C16H14O3)n
Physical Properties:Polycarbonate resin, usually supplied as transparent or slightly yellow granules; density approx. 1.20 g/cm³, refractive index approx. 1.585; insoluble in water, soluble in halogenated hydrocarbons such as dichloromethane and chloroform; glass transition temperature approx. 145–150°C, heat distortion temperature approx. 125–130°C, thermal decomposition temperature above 300°C; exhibits high dielectric constant, low dielectric loss, excellent dimensional stability and injection molding processability.
Uses:Used in RF antenna components of portable electronic products such as mobile devices, tablets, game consoles and digital cameras, enabling antenna miniaturization in limited space. Also applicable to high-precision electronic components, connectors, electromagnetic shielding materials, and other occasions requiring high dielectric constant, low loss and good processability.
Technical Specifications:
Dielectric constant (1 MHz): 4.0–6.0, meeting antenna miniaturization design requirements
Dielectric dissipation factor (1 MHz): ≤0.01
Density: approx. 1.20 g/cm³
Glass transition temperature: approx. 145–150°C
Water absorption (24h): ≤0.15%
English Name:High Dielectric Constant PC Resin
CAS No.:25037-45-0
Aliases:High-k Polycarbonate Resin, High-k PC Resin
Molecular Formula:(C16H14O3)n
Physical Properties:Polycarbonate resin, usually supplied as transparent or slightly yellow granules; density approx. 1.20 g/cm³, refractive index approx. 1.585; insoluble in water, soluble in halogenated hydrocarbons such as dichloromethane and chloroform; glass transition temperature approx. 145–150°C, heat distortion temperature approx. 125–130°C, thermal decomposition temperature above 300°C; exhibits high dielectric constant, low dielectric loss, excellent dimensional stability and injection molding processability.
Uses:Used in RF antenna components of portable electronic products such as mobile devices, tablets, game consoles and digital cameras, enabling antenna miniaturization in limited space. Also applicable to high-precision electronic components, connectors, electromagnetic shielding materials, and other occasions requiring high dielectric constant, low loss and good processability.
Technical Specifications:
Dielectric constant (1 MHz): 4.0–6.0, meeting antenna miniaturization design requirements
Dielectric dissipation factor (1 MHz): ≤0.01
Density: approx. 1.20 g/cm³
Glass transition temperature: approx. 145–150°C
Water absorption (24h): ≤0.15%
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常见问题
- 高介电常数PC树脂的 CAS 号是多少？
- 高介电常数PC树脂的 CAS 号是 None。
- 高介电常数PC树脂的分子式和分子量是什么？
- 高介电常数PC树脂的分子式为 (C16H14O3)n。
- 高介电常数PC树脂的英文名称是什么？
- 高介电常数PC树脂的英文名称为 High Dielectric Constant PC Resin。
- 高介电常数PC树脂还有哪些别名？
- 高介电常数PC树脂又称 高介电常数聚碳酸酯树脂、高介电聚碳酸酯。
- 高介电常数PC树脂有哪些供应商和生产厂家？
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- 平台上高介电常数PC树脂的供应级别包括 工业级。
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- 掌上化工高介电常数PC树脂产品页汇总了各供应商的最新报价与规格，地址：/chemicals/gao-jie-dian-chang-shu-pc-shu-zhi/。部分供应商价格为电议，可通过页面上的询价功能直接获取。
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