连接器电子电器材料HTN51G35HSL原包 (CAS No.None)
- 物化性质
- HTN51G35HSL 为 35% 玻纤增强的 PA6T/XT 高性能聚酰胺(PPA)颗粒料。具有高耐热性、高强度、高刚性、优异的尺寸稳定性、低吸水率、良好的耐化学性和电绝缘性,适合注塑成型薄壁复杂制件。
- 技术参数
- 35% 玻纤增强,经热稳定化处理并含润滑剂。 密度约 1.40 g/cm³。 熔融温度约 300°C,热变形温度(1.82 MPa)约 250°C。 拉伸强度约 170 MPa,弯曲模量约 9000 MPa。 吸水率低,尺寸稳定性好,电绝缘性能优异。
English description(英文原文,共 1311 字符)
Product Name:HTN51G35HSL High Performance Polyamide (PPA)
English Name:HTN51G35HSL High Performance Polyamide (PPA)
CAS No.:25750-60-7
Aliases:DuPont Zytel HTN 51G35HSL, High-temperature nylon HTN51G35HSL, PPA 35% glass-fiber reinforced grade
Molecular Formula:(C14H18N2O2)n
Physical Properties:HTN51G35HSL is a 35% glass-fiber reinforced PA6T/XT high-performance polyamide (PPA) supplied in pellet form. It features high heat resistance, high strength and stiffness, excellent dimensional stability, low water absorption, good chemical resistance, and outstanding electrical insulation. It is suitable for injection molding of thin-wall and complex parts.
Uses:It is mainly used in automotive parts, gears, connectors, housings, switches, office equipment, and electronic/electrical components. Its high heat resistance and mechanical strength meet the long-term service requirements of precision connectors and complex structural parts.
Technical Specifications:
35% glass-fiber reinforced, heat-stabilized and lubricated.
Density approx. 1.40 g/cm³.
Melting temperature approx. 300°C; heat deflection temperature approx. 250°C (1.82 MPa).
Tensile strength approx. 170 MPa; flexural modulus approx. 9000 MPa.
Low water absorption, good dimensional stability, and outstanding electrical insulation.
English Name:HTN51G35HSL High Performance Polyamide (PPA)
CAS No.:25750-60-7
Aliases:DuPont Zytel HTN 51G35HSL, High-temperature nylon HTN51G35HSL, PPA 35% glass-fiber reinforced grade
Molecular Formula:(C14H18N2O2)n
Physical Properties:HTN51G35HSL is a 35% glass-fiber reinforced PA6T/XT high-performance polyamide (PPA) supplied in pellet form. It features high heat resistance, high strength and stiffness, excellent dimensional stability, low water absorption, good chemical resistance, and outstanding electrical insulation. It is suitable for injection molding of thin-wall and complex parts.
Uses:It is mainly used in automotive parts, gears, connectors, housings, switches, office equipment, and electronic/electrical components. Its high heat resistance and mechanical strength meet the long-term service requirements of precision connectors and complex structural parts.
Technical Specifications:
35% glass-fiber reinforced, heat-stabilized and lubricated.
Density approx. 1.40 g/cm³.
Melting temperature approx. 300°C; heat deflection temperature approx. 250°C (1.82 MPa).
Tensile strength approx. 170 MPa; flexural modulus approx. 9000 MPa.
Low water absorption, good dimensional stability, and outstanding electrical insulation.
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- 连接器电子电器材料HTN51G35HSL原包的英文名称为 HTN51G35HSL High Performance Polyamide (PPA)。
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- 连接器电子电器材料HTN51G35HSL原包又称 杜邦 Zytel HTN 51G35HSL、高温尼龙 HTN51G35HSL、PPA 35%玻纤增强级。
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