PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料 (CAS No.None)
- 物化性质
- 半结晶-晶体材料,结晶度高,熔点264℃,密度约1.39g/cm³,在较高温度下仍能保持较强的强度和刚度,刚性和耐热性较高;成型后具有吸湿性,粘度较低、流动性好,粘度对温度变化敏感。
- 熔点
- 264℃。
English description(英文原文,共 1776 字符)
Product Name:DuPont PA66 70G33L 33% Glass Fiber Reinforced High Temperature High Strength Material for Electrical/Electronic Parts
English Name:DuPont PA66 70G33L 33% Glass Fiber Reinforced High Temperature High Strength Material for Electrical/Electronic Parts
CAS No.:32131-17-2
Aliases:Nylon 66, Polyamide 66, PA66, DuPont 70G33L
Molecular Formula:(C12H22N2O4)n
Physical Properties:Semi-crystalline to crystalline material with high crystallinity. Melting point 264°C, density approximately 1.39 g/cm³. It maintains high strength and stiffness at elevated temperatures, with high rigidity and heat resistance. Hygroscopic after molding, low viscosity with good flowability, and viscosity sensitive to temperature changes.
Uses:PA66 is the variety with the highest mechanical strength and widest application in the PA series. Due to its high crystallinity, it has high rigidity and heat resistance. It is suitable for high-temperature electrical socket parts, electrical parts, gears, bearings, rollers, spring brackets, pulleys, bolts, impellers, fan blades, propellers, high-pressure sealing gaskets, valve seats, oil delivery pipes, oil storage containers, ropes, cable ties, transmission belts, battery boxes, insulating electrical parts, and similar applications.
Technical Specifications:
Melting point: 264°C.
Melting temperature: 260–290°C (275–280°C for glass-fiber reinforced grades); avoid exceeding 300°C.
Mold temperature: 80°C recommended; for thin-wall parts, annealing is required if mold temperature is below 40°C.
Injection pressure: 750–1250 bar; injection speed should be high, slightly lower for reinforced materials.
Mold shrinkage: 1%–2%; reduced to 0.2%–1% with glass fiber addition; vacuum dry at 105°C for 12 h if moisture exceeds 0.2%.
English Name:DuPont PA66 70G33L 33% Glass Fiber Reinforced High Temperature High Strength Material for Electrical/Electronic Parts
CAS No.:32131-17-2
Aliases:Nylon 66, Polyamide 66, PA66, DuPont 70G33L
Molecular Formula:(C12H22N2O4)n
Physical Properties:Semi-crystalline to crystalline material with high crystallinity. Melting point 264°C, density approximately 1.39 g/cm³. It maintains high strength and stiffness at elevated temperatures, with high rigidity and heat resistance. Hygroscopic after molding, low viscosity with good flowability, and viscosity sensitive to temperature changes.
Uses:PA66 is the variety with the highest mechanical strength and widest application in the PA series. Due to its high crystallinity, it has high rigidity and heat resistance. It is suitable for high-temperature electrical socket parts, electrical parts, gears, bearings, rollers, spring brackets, pulleys, bolts, impellers, fan blades, propellers, high-pressure sealing gaskets, valve seats, oil delivery pipes, oil storage containers, ropes, cable ties, transmission belts, battery boxes, insulating electrical parts, and similar applications.
Technical Specifications:
Melting point: 264°C.
Melting temperature: 260–290°C (275–280°C for glass-fiber reinforced grades); avoid exceeding 300°C.
Mold temperature: 80°C recommended; for thin-wall parts, annealing is required if mold temperature is below 40°C.
Injection pressure: 750–1250 bar; injection speed should be high, slightly lower for reinforced materials.
Mold shrinkage: 1%–2%; reduced to 0.2%–1% with glass fiber addition; vacuum dry at 105°C for 12 h if moisture exceeds 0.2%.
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常见问题
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料的 CAS 号是多少?
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料的 CAS 号是 None。
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料的分子式和分子量是什么?
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料的分子式为 (C12H22N2O4)n。
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料的英文名称是什么?
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料的英文名称为 DuPont PA66 70G33L 33% Glass Fiber Reinforced High Temperature High Strength Material for Electrical/Electronic Parts。
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料还有哪些别名?
- PA66 美杜邦70G33L 33%玻纤增强 耐高温高强度电子电器原料又称 尼龙66、聚己二酰己二胺、聚酰胺66、杜邦70G33L。
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