PC+ABS LDS3710 镭雕电镀级 LDS天线料 (CAS No.None)
- 物化性质
- 黑色颗粒,激光直接成型(LDS)镭雕电镀级材料。以PC/ABS合金为基体,内含可激光活化的有机金属复合物,激光照射后释放金属粒子,可通过化学镀实现选择性金属化。具有高冲击强度、优良的电镀结合力与射频性能,尺寸稳定性好,耐化学性较佳,适合注塑成型。
- 外观
- 黑色颗粒,适用于注塑成型
English description(英文原文,共 1500 字符)
Product Name:PC+ABS LDS3710 Laser Direct Structuring Plating Grade LDS Antenna Material
English Name:PC+ABS LDS3710 Laser Direct Structuring Plating Grade LDS Antenna Material
Aliases:LDS3710, PC/ABS LDS3710-10701, Mitsubishi LDS antenna material
Physical Properties:Black pellets for laser direct structuring (LDS) plating grade. Based on a PC/ABS alloy matrix containing a laser-activatable organometallic compound; upon laser irradiation, metal particles are released for subsequent selective electroless plating. It offers high impact strength, excellent plating adhesion and RF performance, good dimensional stability, and chemical resistance, and is suitable for injection molding.
Uses:Used as an LDS laser structuring antenna material in 3D-MID technology. It is typically adopted to manufacture mobile phone/communication device antennas, integrated antenna structures, electronic components (connectors, switches, housings), and automotive electronic parts. Conductive circuit patterns are formed by laser activation followed by electroless copper/nickel plating.
Technical Specifications:
Resin system: PC/ABS alloy with laser-activatable organometallic compound
Appearance: black pellets, suitable for injection molding
Processing method: LDS laser direct structuring followed by electroless plating
Mechanical performance: high impact strength and excellent plating adhesion
RF performance: stable metal trace adhesion after laser structuring, suitable for antenna applications
English Name:PC+ABS LDS3710 Laser Direct Structuring Plating Grade LDS Antenna Material
Aliases:LDS3710, PC/ABS LDS3710-10701, Mitsubishi LDS antenna material
Physical Properties:Black pellets for laser direct structuring (LDS) plating grade. Based on a PC/ABS alloy matrix containing a laser-activatable organometallic compound; upon laser irradiation, metal particles are released for subsequent selective electroless plating. It offers high impact strength, excellent plating adhesion and RF performance, good dimensional stability, and chemical resistance, and is suitable for injection molding.
Uses:Used as an LDS laser structuring antenna material in 3D-MID technology. It is typically adopted to manufacture mobile phone/communication device antennas, integrated antenna structures, electronic components (connectors, switches, housings), and automotive electronic parts. Conductive circuit patterns are formed by laser activation followed by electroless copper/nickel plating.
Technical Specifications:
Resin system: PC/ABS alloy with laser-activatable organometallic compound
Appearance: black pellets, suitable for injection molding
Processing method: LDS laser direct structuring followed by electroless plating
Mechanical performance: high impact strength and excellent plating adhesion
RF performance: stable metal trace adhesion after laser structuring, suitable for antenna applications
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常见问题
- PC+ABS LDS3710 镭雕电镀级 LDS天线料的 CAS 号是多少?
- PC+ABS LDS3710 镭雕电镀级 LDS天线料的 CAS 号是 None。
- PC+ABS LDS3710 镭雕电镀级 LDS天线料的英文名称是什么?
- PC+ABS LDS3710 镭雕电镀级 LDS天线料的英文名称为 PC+ABS LDS3710 Laser Direct Structuring Plating Grade LDS Antenna Material。
- PC+ABS LDS3710 镭雕电镀级 LDS天线料还有哪些别名?
- PC+ABS LDS3710 镭雕电镀级 LDS天线料又称 LDS3710、PC/ABS LDS3710-10701、日本三菱LDS天线材料。
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